二甲基聚硅氧烷，Dimethylpolysiloxane [DMPS]；viscosity 20 cSt (25 °C)(lit.)
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无水硫酸铜，Copper(II) sulfate；free-flowing, Redi-Dri™, ReagentPlus®, ≥99% -
无水硫酸铜，Copper(II) sulfate；puriss. p.a., anhydrous, ≥99.0% (RT) -
氯化钡二水合物，Barium chloride dihydrate；≥99% -
苯基琼脂糖凝胶6FF HS，Phenyl Beads 6FF (High Sub) -
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1,2-二氯四氟乙烷，1,2-Dichlorotetrafluoroethane [CFC-114]；≥99.5% -
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叔丁醇钾溶液，Potassium tert-butoxide solution [t-BuOK]；1.0 M in THF
