乙基磷酸二乙酯,Diethyl Ethylphosphonate
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白术内酯III,Atractylenolide III;phyproof® Reference Substance, ≥98.0% (HPLC) -
四硼酸锂,Lithium tetraborate;≥99.9% trace metals basis -
三甲基氯化锡,Trimethyltin chloride -
苯磺酸乙酯,Ethyl benzenesulfonate;≥98.0%(GC) -
罗汉松脂酚,Matairesinol;phyproof® Reference Substance, ≥95.0% (HPLC) -
硅,Silicon;wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm
