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RTM溶液B,RTM solution B

别名:常温镀镍溶液;Room temperature nickel metallizing solution; NACRES: NA.23
制造商品牌: 西格玛 Sigma-Aldrich
货号(SKU): 901663
增值税发票 √ 免费送货 √ 订货电话:010-68689484
¥2,519.09

说明

用于氧化铝陶瓷和其他介电材料的室温镍金属化 (RTM) 工艺 - 可以电镀、焊接、钎焊或焊接牢固结合的镍。

RTM 工艺提供了一种可靠、简单且经济的方法,可在室温下金属化介电(非导体)材料。这种镍金属化工艺特别适用于商业氧化铝型陶瓷。上面说明了 5 个基本操作中的处理顺序。

如果陶瓷材料已经显示出平均至少 20 微英寸的表面粗糙度,则可以省略用 Polimet 研磨剂对陶瓷材料进行预处理。使用 Polimet 化合物进行表面研磨将产生均匀的表面,平均粗糙度为 25 微英寸。

RTM 中使用的 A-B-C-D 溶液的组成和配方可以很好地控制金属化过程。发现镍沉积物无应力、高导电性和极强的粘附性,在 -60 °C 时表现出很强的粘合强度。至 + 850 °C。沉积时的硬度至少为 500(维氏)。可以对附着的镍沉积物进行电镀、焊接、铜焊或焊接。

一般描述

Room-temperature nickel metallizing (RTM) process for alumina ceramics and other dielectric materials − strongly bonded nickel can be plated, soldered, brazed or welded.
 

应用

  • The RTM process is applicable to metallizing alumina substrates in hybrid and microcircuits, insulated heat sinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.
  • The RTM process is also useful for metallizing barium titanate and ferrites. In addition, many polymeric materials, notable polyesters, epoxies, cellulosics, mylar and acrylonitrile-butadiene-styrene (ABS terpolymer) may be metallized following suitable modifications of the etch (Solution A).
  • RTM lends itself productively to the application of photolithographic technology using photo resist materials to register metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits. Base plates for building capacitor structures are also quite feasible.

特点和优势

UNIQUE FEATURES:
  • Low cost metallization process.
  • Excellent bond strength - 100 psi typical.
  • Withstands temperature extremes - −65 °C. to + 850 °C.
  • Passes Mil specifications for temperature cycling and shock.
  • Hermeticity - leak rate < 10-8cc helium/second.</LI>Permits registration of metallization patterns with good resolution using photolithographic techniques and mechanical masking.
  • Process applicable to beryllia, barium titanate, ferrites, epoxies, mylar and other dielectrics.

The RTM process offers a reliable, yet simple and economical method to metallize dielectric (non-conductor) materials at room temperature. This metallizing process with nickel is specially suited for commercial alumina type ceramics. The process sequence in 5 basic operations is illustrated above.

Pretreatment of the ceramic material with Polimet lapping compound may be omitted if the ceramic material already shows surface roughness of at least 20 microinches, average. Surface lapping with Polimet compound will result in a uniform surface with a roughness of 25 microinches average.

The composition and formulation of A-B-C-D solutions used in RTM permit excellent control of the metallization process. The nickel deposit is found to be unstressed, highly conductive, and extremely adherent with strong bond strength exhibited from -60 °C. to + 850 °C. It has a hardness of at least 500 (vickers) as deposited. The adherent nickel deposit may be plated, soldered, brazed or welded.
 
 

属性

形式

liquid

颜色

light brown

pH值(酸碱度)

<2

 

安全信息

象形图

CorrosionSkull and crossbones

警示用语:

Danger

危险分类

Acute Tox. 1 Dermal - Acute Tox. 2 Inhalation - Acute Tox. 2 Oral - Eye Dam. 1 - Skin Corr. 1A

储存分类代码

6.1B - Non-combustible, acute toxic Cat. 1 and 2 / very toxic hazardous materials

WGK

WGK 2

商品规格
属性名称属性值
储存温度 Storage temp.常温阴凉避光
全球实时库存 Availability √美国St. Louis ≥ 55 | 欧洲Eur. ≥ 16 | 東京Tokyo ≥ 8 | 香港与北京 ≥ 10
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