(R)-(-)-扁桃酸,(R)-(−)-Mandelic acid;98%
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聚(偏二氟乙烯-co-三氟乙烯),Solvene®250/P300;P(VDF-TrFE) -
二苯甲酮,Benzophenone;purified by sublimation, ≥99% -
聚(3,4-乙烯二氧噻吩)-聚(苯乙烯磺酸酯),Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) [PEDOT:PSS];1.1% in H2O, surfactant-free, high-conductivity grade -
化学镀镍溶液,Electroless nickel plating strike -
正戊醇,1-Pentanol;ReagentPlus®, ≥99% -
双(三氟甲烷)磺酰亚胺锂盐,Bis(trifluoromethane)sulfonimide lithium salt [Li-TFSI];99.95% trace metals basis
