过滤
关闭导航

F型铝蚀刻剂,Aluminum Etchant Type F

别名:用于铝和铝硅金属化的铝蚀刻溶液;Aluminum etching solution for Al and Al-Si metallization;NACRES: NA.23
制造商品牌: 西格玛 Sigma-Aldrich
货号(SKU): 901537
增值税发票 √ 免费送货 √ 订货电话:010-68689484
¥944.17

说明

F型铝蚀刻剂是一种稳定的制剂,用于蚀刻硅器件和集成电路应用中的铝或铝硅金属化层。 定义铝触点并形成互连。 铝蚀刻剂F型配方具有独特的性能,可轻松克服铝蚀刻过程中遇到的许多困难,例如残留物。 使用光刻技术的铝金属化和蚀刻工艺是半导体和微电子技术的基础。
铝蚀刻剂 F 型与许多商业光刻胶高度兼容,并允许描绘成高分辨率图案。 1 mil 的金属线宽和小于 5 微米的分离是可行的。 高分辨率对于铝蚀刻剂F型是实用的,因为不会发生光刻胶图案的提升,并且底切被最小化。

一般描述

Aluminum Etchant Type F is a stable preparation used to etch aluminum or aluminum-silicon metallizations on silicon devices and in integrated circuit applications. Aluminum contacts are defined and interconnections are formed. Aluminum Etchant Type F is formulated with unique properties easily overcome many of the difficulties experienced in aluminum etch processes such as residue. The aluminum metallization and etching process using photo-lithographic techniques is basic to the semiconductor and microelectronic technology.
The Aluminum Etchant Type F is highly compatible with many of commercial photoresists and permit delineation into high resolution patterns. Metal line width of 1 mil and separations less than 5 microns are feasible. The high resolution is practical with the Aluminum Etchant Type F because lifting of photoresist patterns does not occur and undercutting is minimized.
 

应用

  • Aluminum Etchant Type F should not be used or stored in glass or Pyrex containers.
  • Aluminum metallizations up to 25,000 A are vacuum deposited on the silicon slice, coated with a photoresist, and UV exposed using an appropriate photographic mask. The resist is developed to protect the aluminum where interconnections are desired. Then the unprotected areas of the aluminum are removed by etching with the Aluminum Etchant Type F, followed by a water rinse.
  • Etching time is dependent upon the etchant temperature and the aluminum film thickness. When etching thick aluminum films, a higher etch rate is required; thus a higher etchant temperature should be used. Likewise, for thinner aluminum films, slower etch rates are desired and a lower etchant temperature should be chosen.
  • At a specific etchant temperature, the etching time is given by the following formula:
Etching time (second) + Film Thickness (Å)/ Etch Rate (Å/sec)
where Etch Rate at 25°C 30 Å/sec; at 40°C 80 Å/sec.
 
 

属性

形式

liquid

 

安全信息

象形图

CorrosionExclamation mark

警示用语:

Danger

危险声明

危险分类

Acute Tox. 4 Oral - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1B

补充剂危害

储存分类代码

8A - Combustible, corrosive hazardous materials

WGK

WGK 1

商品规格
属性名称属性值
储存温度 Storage temp.常温阴凉避光
全球实时库存 Availability √美国St. Louis ≥ 99 | 欧洲Eur. ≥ 10 | 東京Tokyo ≥ 22 | 香港与北京 ≥ 32