镍铬合金蚀刻剂,Nichrome etchant;standard
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高速光亮铜电镀液 (半导体级),High speed bright copper electroplating solution;semiconductor grade
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十乙二醇单十二烷基醚,Decaethylene glycol monododecyl ether [C12E10];nonionic surfactant
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细菌蛋白酶,Proteinase, bacterial;Type XXIV, 7.0-14.0 units/mg solid, lyophilized powder
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邻苯二酚 [儿茶酚],1,2-Dihydroxybenzene;ReagentPlus®, ≥99%
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硫酸鱼精蛋白 [鲑鱼精蛋白硫酸盐],Protamine sulfate;meets USP testing specifications, ≥92% (chromatography), 90.0-110.0% dry basis
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1-戊炔,1-Pentyne;99%