钨酸钠二水合物 [二水钨酸钠],Sodium tungstate dihydrate;99.995% trace metals basis
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聚吡咯,Polypyrrole [PPy];conductivity 10-50 S/cm (pressed pellet) -
N-对-甲苯磺酰基-L-苯基乙基氯甲基酮,N-p-Tosyl-L-phenylalanine chloromethyl ketone [TPCK];≥97% (TLC), powder -
三甲氧基(2-苯乙基)硅烷,Trimethoxy(2-phenylethyl)silane [TMPES];98% -
N-十二烷基-N,N-二甲基-3-铵-1-丙磺酸盐,N-Dodecyl-N,N-dimethyl-3-ammonio-1-propanesulfonate;≥97.0% (dried material, CHN) -
磷酸二氢钾,Potassium phosphate monobasic;ReagentPlus®, ≥99.0% -
硫氰酸钠,Sodium thiocyanate;ACS reagent, ≥98.0%
