钨蚀刻剂，Tungsten etchant
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![图片 二氧化硅，Silicon dioxide [Silica]；mesoporous SBA-15, <150 μm particle size, pore size 8 nm, Hexagonal pore morphology](https://www.bszh.cn/images/thumbs/0014052_silicon-dioxide-silicamesoporous-sba-15-150-m-particle-size-pore-size-8-nm-hexagonal-pore-morphology_32.png "显示明细 二氧化硅，Silicon dioxide [Silica]；mesoporous SBA-15, <150 μm particle size, pore size 8 nm, Hexagonal pore morphology")
二氧化硅，Silicon dioxide [Silica]；mesoporous SBA-15, <150 μm particle size, pore size 8 nm, Hexagonal pore morphology -
琼脂糖，Agarose；Type I-A, low EEO -
![图片 二硫化钨(IV) [嵌锂]，Tungsten (IV) disulfide；lithium intercalated](https://www.bszh.cn/images/thumbs/0014264_iv-tungsten-iv-disulfidelithium-intercalated_32.jpeg "显示明细 二硫化钨(IV) [嵌锂]，Tungsten (IV) disulfide；lithium intercalated")
二硫化钨(IV) [嵌锂]，Tungsten (IV) disulfide；lithium intercalated -
氢氧化钾, 粉末，Potassium hydroxide；for synthesis -
甲基-PEG12-叠氮化物，Methyl-PEG12-Azide；≥98% -
芹菜素，Apigenin；analytical standard, ≥99% (HPLC)
