环氧活化琼脂糖凝胶4FF,Epoxy-Activated Beads 4FF
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O-[(乙氧基羰基)氰基甲胺]-N,N,N',N'-四甲基硫脲六氟磷酸盐,O-[(Ethoxycarbonyl)cyanomethylenamino]-N,N,N',N'-tetramethyluronium hexafluorophosphate [HOTU];98%
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背栅OFET基板,Back-gated OFET Substrate;n-doped silicon wafer with 230 nm SiO2 gate-insulator, chips (diced)
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2-全氟癸基丙烯酸乙酯,2-(Perfluorodecyl)ethyl Acrylate
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美国杜邦树脂,DuPont Resin
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二硫化铁,Iron disulfide;powder, −325 mesh, 99.8% trace metals basis
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安伯莱特IRA-900氯型强碱性阴离子交换树脂,Amberlite™ IRA-900 chloride form;650-820 μm