殷钢电镀液，Invar electroplating solution

Invar electroplating solution is designed for the fabrication of low stress, pinhole-free nickel-iron alloy films with extremely low coefficients of thermal expansion.

 

• Deposits have low internal stress and are very ductile.
• Near-zero linear thermal expansion in plated alloy films.
• Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity.
• Qualified bath metrology for replenishment and a long shelf life.

Electroplated Invar film (5-10 μm thickness) properties:
1. Density: 8.1 g/cm³
2. Composition: 64 wt% Fe, 36 wt% Ni
3. Linear thermal expansion: 0.4 ± 0.1 * 10^-6 K^-1
4. Specific heat copacity at 573K: 0.45 ± 0.05 J/gK
5. Thermal conductivity: 43 ± 5 W/mK
6. Internal stress: 30 ± 2 MPa
7. Tensile strength: 500 ± 60 MPa
8. Yield strength: 280 ± 50 MPa
9. Ductility: 40 ±10 %