乙二醇二甲醚溴化镍,Nickel(II) bromide ethylene glycol dimethyl ether complex;97%
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1,2-二甲氧基乙烷 [乙二醇二甲醚],1,2-Dimethoxyethane [DME];ReagentPlus®, ≥99%, inhibitor-free -
聚乙烯亚胺溶液,Poly(ethyleneimine) solution [PEI];Mr 600,000-1,000,000; ~50% in H2O -
2-[2-(2-丙炔氧基)乙氧基]乙醇,2-[2-(2-Propynyloxy)ethoxy]ethanol;≥98% -
HiPrep Sephacryl S-300 HR预装柱,Sephacryl S-300 HR SEC resin in HiPrep Columns -
乙酰丙酮锰(III),Manganese(III) acetylacetonate;technical grade
